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Rebased onto main as one commit (the six commits of #374). A uniform fill over a depth surface's whole HTILE (DMA_DATA, the fill kernels or a CPU store) clears the depth and stencil aspects its ZMask and SMem fields say, to DB_DEPTH_CLEAR / DB_STENCIL_CLEAR, when the surface is next bound or sampled. Main's RADV clear_htile_mask recognition (#2229) now goes through the same pending clear: an HTILE clear marks the matching surfaces' depth aspect, and one for a surface not created yet is applied when it is first bound. Main's HTILE address decode and this one are merged into one (TILE_SURFACE_ENABLE, a nonzero DB_HTILE_DATA_BASE and a depth format). Co-Authored-By: Claude Opus 5.5 (1M context) <noreply@anthropic.com>